A light-emitting device comprises a transparent substrate, an LED die on the transparent substrate, a second substrate on the LED die, and two electrode pins located between the transparent substrate and the second substrate. The LED die comprises a first surface, a second surface opposite to the first surface, and two electrodes located on the first surface, wherein the LED die is enclosed by the transparent substrate and the second substrate, and the two electrodes of the LED die respectively connect to the two electrode pins without a wire bonding process. Each of the two electrode pins comprises a first end and a second end opposite to the first end, and the first end is sandwiched by the LED die and the second substrate, and the second end extends out of the transparent substrate and the second substrate; wherein the first surface comprises a side and the two electrode pins extend in parallel from the side of the LED die toward a same direction away from the side.