Invention Grant
- Patent Title: Piezoelectric thin film stack
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Application No.: US15026311Application Date: 2013-10-30
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Publication No.: US10680160B2Publication Date: 2020-06-09
- Inventor: James Elmer Abbott, Jr. , Peter Mardilovich , Brady Gibbons , Bryan Alexander Maack
- Applicant: Hewlett-Packard Development Company, L.P. , State of Oregon on behalf of Oregon State Univ.
- Applicant Address: US OR Corvallis US TX Spring
- Assignee: Oregon State University,Hewlett-Packard Development Company, L.P.
- Current Assignee: Oregon State University,Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US OR Corvallis US TX Spring
- Agency: Thorpe, North & Western
- International Application: PCT/US2013/067614 WO 20131030
- International Announcement: WO2015/065397 WO 20150507
- Main IPC: H01L41/09
- IPC: H01L41/09 ; H01L41/27 ; H01L41/332 ; H01L41/08 ; B41J2/16 ; B41J2/14 ; H01L41/047 ; H01L41/187
Abstract:
The present disclosure is drawn to a piezoelectric thin film stack and method of preparing the same. The piezoelectric thin film stack can comprise a substrate with an oxide application surface, a metal oxide adhesive blend layer applied to the oxide application surface, and a piezoelectric film applied directly to the metal oxide adhesive blend layer.
Public/Granted literature
- US20160240769A1 PIEZOELECTRIC THIN FILM STACK Public/Granted day:2016-08-18
Information query
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