Invention Grant
- Patent Title: Motherboard substrate, motherboard panel, display panel, manufacturing method thereof, and display device
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Application No.: US15735368Application Date: 2017-06-21
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Publication No.: US10680211B2Publication Date: 2020-06-09
- Inventor: Zhenli Zhou , Zhiliang Jiang , Yinan Liang
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Sichuan
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Sichuan
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3d924fe4
- International Application: PCT/CN2017/089338 WO 20170621
- International Announcement: WO2018/024041 WO 20180208
- Main IPC: H01L51/56
- IPC: H01L51/56 ; H01L51/52

Abstract:
A motherboard substrate, a motherboard panel, a display panel, a display device and a method for manufacturing the display panel are provided. The motherboard substrate comprises a plurality of display substrates arranged in an array and regions provided between adjacent display substrates. Each display substrate includes a region to be packaged; a first reflection structure is provided at the region to be packaged; a second reflection structure is provided on the outside of the display substrate and in the region between adjacent display substrates; and the second reflection structure and the first reflection structure are spaced apart from each other.
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Information query
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