Invention Grant
- Patent Title: Housing structure of printed circuit board with connector
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Application No.: US16394654Application Date: 2019-04-25
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Publication No.: US10680377B2Publication Date: 2020-06-09
- Inventor: Junya Ichikawa , Hidetoshi Yata , Takashi Miyakawa
- Applicant: AISIN SEIKI KABUSHIKI KAISHA
- Applicant Address: JP Kariya-shi, Aichi-ken
- Assignee: AISIN SEIKI KABUSHIKI KAISHA
- Current Assignee: AISIN SEIKI KABUSHIKI KAISHA
- Current Assignee Address: JP Kariya-shi, Aichi-ken
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@513b9600
- Main IPC: H01R13/46
- IPC: H01R13/46 ; H05K5/00 ; H01R12/72

Abstract:
A housing structure of a printed circuit board with a connector includes the printed circuit board on which an electronic component is implemented, the connector implemented on an end portion of the printed circuit board, the connector including a fitted portion fitted with a mating component which is a connection target, and a housing accommodating the printed circuit board and the connector. The housing includes a first case surrounding the printed circuit board and a second case covering the connector. The second case includes a first surface portion arranged at a side where the fitted portion of the connector is provided, and at least one second surface portion which is nonparallel to the first surface portion.
Public/Granted literature
- US20190334276A1 HOUSING STRUCTURE OF PRINTED CIRCUIT BOARD WITH CONNECTOR Public/Granted day:2019-10-31
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