A bridge array for connecting electronic components within a housing includes an array bracket and a plurality of connection modules coupled to the array bracket. Each connection module includes a first electrical connector configured to receive a first electronic component, and a second electrical connector configured to receive a second electronic component; thereby physically and electrically connecting the first electronic component and the second electronic component of each connection module. The array bracket includes a first electrical port electrically connected to the first electrical connector of each connection module. The first electrical port provides a common connection to the first electronic component of each connection module. The array bracket includes a second electrical port electrically connected to the second electrical connector of each connection module. The second electrical port provides a common connection to the second electronic component of each connection module.