Invention Grant
- Patent Title: Acoustic wave device, multiplexer, high-frequency front-end circuit, and communication apparatus
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Application No.: US16561244Application Date: 2019-09-05
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Publication No.: US10680577B2Publication Date: 2020-06-09
- Inventor: Ryo Nakagawa , Hideki Iwamoto , Tsutomu Takai
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@e8572bb
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03F3/20 ; H03H9/145 ; H03H9/25 ; H03H9/64 ; H04B1/04

Abstract:
An acoustic wave device includes a silicon oxide film, a piezoelectric body made of lithium tantalate, and interdigital transducer electrodes stacked on a supporting substrate made of silicon, in which the values of the wave length-normalized film thickness and the Euler angle of the piezoelectric body made of lithium tantalate, the wave length-normalized film thickness of the silicon oxide film, the wave length-normalized film thickness of the interdigital transducer electrodes in terms of aluminum thickness, the propagation direction of the supporting substrate, and the wave length-normalized film thickness of the supporting substrate are set such that represented by Formula (1) for at least one of responses of first, second, and third higher-order modes is more than about −2.4, and TSi>20.
Public/Granted literature
- US20200007109A1 ACOUSTIC WAVE DEVICE, MULTIPLEXER, HIGH-FREQUENCY FRONT-END CIRCUIT, AND COMMUNICATION APPARATUS Public/Granted day:2020-01-02
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