Invention Grant
- Patent Title: Flexible circuit board with improved bonding flatness
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Application No.: US16224967Application Date: 2018-12-19
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Publication No.: US10681803B2Publication Date: 2020-06-09
- Inventor: Byung Hoon Jo , Sang Pil Kim , Byung Yeol Kim , Hee seok Jung
- Applicant: GigaLane Co., Ltd.
- Applicant Address: KR Hwaseong-si, Gyeonggi-Do
- Assignee: GIGALANE CO., LTD.
- Current Assignee: GIGALANE CO., LTD.
- Current Assignee Address: KR Hwaseong-si, Gyeonggi-Do
- Agency: Brundidge & Stanger, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@d15dfb
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/14 ; H05K1/18
Abstract:
In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and a flatness improvement portion disposed on an upper portion of the second ground.
Public/Granted literature
- US20190230787A1 FLEXIBLE CIRCUIT BOARD WITH IMPROVED BONDING FLATNESS Public/Granted day:2019-07-25
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