Invention Grant
- Patent Title: Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor package
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Application No.: US16499448Application Date: 2018-03-28
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Publication No.: US10681807B2Publication Date: 2020-06-09
- Inventor: Norihiko Sakamoto , Hiroshi Yokota , Shintaro Hashimoto , Katsuhiko Nawate , Shinji Tsuchikawa , Shin Takanezawa
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7a1d523f
- International Application: PCT/JP2018/012846 WO 20180328
- International Announcement: WO2018/181516 WO 20181004
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K3/46 ; C08J5/24
Abstract:
The present invention provides a prepreg for a coreless substrate including a thermosetting resin composition containing (a) (meth)acrylic elastomer, (b) an amine compound having at least two primary amino groups, and (c) a maleimide compound having at least two N-substituted maleimide groups, and a coreless substrate using the same, a method of manufacturing the coreless substrate, and a semiconductor package.
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