Techniques for constructing a wafer based module are provided herein. For example, the techniques include providing a substrate, forming a pattern of conductive material relative to at least one of a surface plane of the substrate and an internal location within the substrate with the pattern of the conductive material including at least an exposed portion, mounting at least one electronic module to the exposed portion of the pattern of the conductive material, orienting the substrate orthogonal relative to a planar mounting surface such that the surface plane of the substrate is substantially orthogonal to the planar mounting surface, mounting one or more additional electronic modules on the planar mounting surface; and forming the semiconductor device by encapsulating the substrate, including the pattern of conductive material, the at least one electronic module and the one or more additional electronic modules within a mold compound.