Invention Grant
- Patent Title: Mounting structure for module in electronic device
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Application No.: US16414076Application Date: 2019-05-16
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Publication No.: US10681823B2Publication Date: 2020-06-09
- Inventor: Hyung Dal Kim , Oh Hyuck Kwon , Han Vit Kang , Jun Young Kim , Moon Kyeong Kim , Sang Seob Kim , Jung Sik Park , Hee Seok Jung , Sung Cho , Heung Sik Shin , Ji Woong Oh
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR
- Agency: The Farrell Law Firm, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@daf7ac3 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@c52500d
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/36 ; G06F1/16 ; G06K9/00 ; H05K1/02 ; A61B5/1172 ; G02F1/1333 ; H04M1/02 ; H05K1/18 ; H05K3/34 ; H05K1/14 ; G02F1/1345
Abstract:
An electronic device is provided. The electronic device includes a display including a display area and a connecting area extending from one side of the display area, a flexible printed circuit board (FPCB) connected with the connecting area, and a first module mounted on a first surface of the FPCB, where the connecting area is bent such that the first module is apart from the display to face the display.
Public/Granted literature
- US20190274222A1 MOUNTING STRUCTURE FOR MODULE IN ELECTRONIC DEVICE Public/Granted day:2019-09-05
Information query
