Invention Grant
- Patent Title: Component supplying device for a component supply tape
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Application No.: US15578188Application Date: 2015-06-02
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Publication No.: US10683184B2Publication Date: 2020-06-16
- Inventor: Kazuyoshi Oyama , Yasuyoshi Hongashi , Tsutomu Yanagida
- Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Applicant Address: JP Shizuoka
- Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Current Assignee Address: JP Shizuoka
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2015/065912 WO 20150602
- International Announcement: WO2016/194142 WO 20161208
- Main IPC: B65H20/22
- IPC: B65H20/22 ; H05K13/04 ; H05K13/02

Abstract:
A component supplying device includes a body portion including a component pick-up position, a tape path, first and second transfer portions, a control portion, and an input portion. The control portion includes a discharge processing portion which executes a discharge process in response to an instruction at the input, and a transfer processing portion which executes a transfer process after the discharge process. In the discharge process, a first component supply tape is transferred by the first transfer portion away from the first transfer position so that at least a part of the first component supply tape is discharged outside the body portion while holding the components. In the transfer process, a second component supply tape that is at the second transfer position is transferred by the second transfer portion toward the first transfer position, and transferred by the first transfer portion toward the component pick-up position.
Public/Granted literature
- US20180148289A1 COMPONENT SUPPLYING DEVICE, SURFACE MOUNTING DEVICE, AND METHOD OF SUPPLYING COMPONENT Public/Granted day:2018-05-31
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