Invention Grant
- Patent Title: Methods and systems to seal subterranean void
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Application No.: US15953002Application Date: 2018-04-13
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Publication No.: US10683725B2Publication Date: 2020-06-16
- Inventor: Hong Wang
- Applicant: Sharp-Rock Technologies, Inc.
- Applicant Address: US TX Houston
- Assignee: Sharp-Rock Technologies, Inc.
- Current Assignee: Sharp-Rock Technologies, Inc.
- Current Assignee Address: US TX Houston
- Agency: Pierson IP, PLLC
- Main IPC: E21B33/13
- IPC: E21B33/13 ; E21B33/138 ; E21B21/00
Abstract:
A device including an expandable material that is configured to be compressed in a first state while traveling through a wellbore and expanded in a second state to form a seal.
Public/Granted literature
- US20180305998A1 METHODS AND SYSTEMS TO SEAL SUBTERRANEAN VOID Public/Granted day:2018-10-25
Information query
