Invention Grant
- Patent Title: Substrate processing apparatus, and thermocouple
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Application No.: US16046682Application Date: 2018-07-26
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Publication No.: US10684174B2Publication Date: 2020-06-16
- Inventor: Akihiro Osaka , Hideto Yamaguchi , Tetsuya Kosugi , Tokunobu Akao , Atsushi Umekawa , Motoya Takewaki
- Applicant: HITACHI KOKUSAI ELECTRIC INC.
- Applicant Address: JP Tokyo
- Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@63001a04 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@28da8cd6
- Main IPC: G01K1/08
- IPC: G01K1/08 ; G01K7/02
Abstract:
A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.
Public/Granted literature
- US20180328790A1 SUBSTRATE PROCESSING APPARATUS, AND THERMOCOUPLE Public/Granted day:2018-11-15
Information query
