Invention Grant
- Patent Title: Multi-scale simulation including first principles band structure extraction
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Application No.: US15224165Application Date: 2016-07-29
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Publication No.: US10685156B2Publication Date: 2020-06-16
- Inventor: Jie Liu , Victor Moroz , Michael C Shaughnessy-Culver , Stephen Lee Smith , Yong-Seog Oh , Pratheep Balasingam , Terry Sylvan Kam-Chiu Ma
- Applicant: SYNOPSYS, INC.
- Applicant Address: US CA Mountain View
- Assignee: SYNOPSYS, INC.
- Current Assignee: SYNOPSYS, INC.
- Current Assignee Address: US CA Mountain View
- Agency: Haynes Beffel & Wolfeld LLP
- Agent Warren S. Wolfeld; Andrew L. Dunlap
- Main IPC: G06F30/20
- IPC: G06F30/20 ; G06F30/33 ; G06F17/10 ; G06F30/23 ; G06F30/327 ; G06F30/367 ; G06F30/3312

Abstract:
Electronic design automation modules include a first tool and a second tool. The first tool includes ab initio simulation procedures configured to use input parameters to produce information about a band structure of a simulated material on a first simulation scale specified at least in part by the input parameters. The second tool includes a simulation procedure configured to used information about the band structure of the simulated material produced by the first tool to extract parameters on a second simulation scale larger than the first simulation scale.
Public/Granted literature
- US20160335381A1 MULTI-SCALE SIMULATION INCLUDING FIRST PRINCIPLES BAND STRUCTURE EXTRACTION Public/Granted day:2016-11-17
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