Invention Grant
- Patent Title: Processing chamber, combination of processing chamber and loadlock, and system for processing substrates
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Application No.: US14952230Application Date: 2015-11-25
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Publication No.: US10685814B2Publication Date: 2020-06-16
- Inventor: Heng Tao , Tuqiang Ni , Qian Wang
- Applicant: Advanced Micro-Fabrication Equipment Inc, Shanghai
- Applicant Address: CN Shanghai
- Assignee: ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA
- Current Assignee: ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA
- Current Assignee Address: CN Shanghai
- Agency: Womble Bond Dickinson (US) LLP
- Agent Joseph Bach, Esq.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@49c9653b
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; H01J37/32 ; B25J11/00
Abstract:
A system for processing substrates having an atmospheric front end and a vacuum main frame, primary processing chambers attached to the main frame, a loadlock positioned between the front end and the main frame, and at least one secondary processing chamber attached to the loadlock.
Public/Granted literature
- US20160351429A1 PROCESSING CHAMBER, COMBINATION OF PROCESSING CHAMBER AND LOADLOCK, AND SYSTEM FOR PROCESSING SUBSTRATES Public/Granted day:2016-12-01
Information query
IPC分类:
