Invention Grant
- Patent Title: 3DIC package comprising perforated foil sheet
-
Application No.: US15595515Application Date: 2017-05-15
-
Publication No.: US10685854B2Publication Date: 2020-06-16
- Inventor: Wensen Hung
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L21/56 ; H01L21/50 ; H01L23/10 ; H01L23/36 ; H01L23/373 ; H01L23/42 ; H01L23/427 ; H01L23/473 ; H01L23/34 ; H01L23/00 ; H01L23/31
Abstract:
A structure includes a thermal interface material, and a Perforated Foil Sheet (PFS) including through-openings therein, with a first portion of the PFS embedded in the thermal interface material. An upper layer of the thermal interface material is overlying the PFS, and a lower layer of thermal interface material is underlying the PFS. The thermal interface material fills through-openings in the PFS.
Public/Granted literature
- US20170250092A1 3DIC Package Comprising Perforated Foil Sheet Public/Granted day:2017-08-31
Information query
IPC分类:
