Invention Grant
- Patent Title: Electrically conductive deterministic lateral displacement array in a semiconductor device
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Application No.: US16189787Application Date: 2018-11-13
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Publication No.: US10685906B2Publication Date: 2020-06-16
- Inventor: Benjamin Wunsch , Joshua T. Smith , Stacey Gifford
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/02 ; H01L21/56 ; H01L21/306 ; H01L23/29 ; H01L21/3213 ; H01L21/48 ; H01L21/033
Abstract:
Devices and methods that can facilitate electrically conductive deterministic lateral displacement (DLD) pillar array components are provided. According to an embodiment, a device can comprise a substrate that can have a channel that can comprise electrically conductive pillar components that can be coupled to one or more electrodes. The device can further comprise a seal layer that can be coupled to the substrate that seals the one or more electrodes.
Public/Granted literature
- US20200152550A1 ELECTRICALLY CONDUCTIVE DETERMINISTIC LATERAL DISPLACEMENT ARRAY IN A SEMICONDUCTOR DEVICE Public/Granted day:2020-05-14
Information query
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