A semiconductor chip module includes a chip package and a printed circuit board (PCB) to which the chip package is mounted. The chip package includes a substrate, a processor disposed in a central region of the substrate, a plurality of active chips disposed around the processor, a plurality of dummy chips disposed in spaces between the plurality of active chips, and an epoxy resin fixing the plurality of active chips and the plurality of dummy chips to the substrate. Channels of the epoxy resin extend between an uppermost surface of a chip body of each of the dummy chips and the substrate of the chip package to control or mitigate warping of the chip package.