- Patent Title: Semiconductor package device and method of manufacturing the same
-
Application No.: US15645975Application Date: 2017-07-10
-
Publication No.: US10685934B2Publication Date: 2020-06-16
- Inventor: Jen-Kuang Fang , Wen-Long Lu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L21/56 ; H01L23/31
Abstract:
A semiconductor device package includes an electronic component, a first set of conductive wires electrically connected to the electronic component, and an insulation layer surrounding the first set of conductive wires. The insulation layer exposes a portion of the first set of the conductive wires. The insulation layer is devoid of a filler.
Public/Granted literature
- US20190013289A1 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2019-01-10
Information query
IPC分类:
