Invention Grant
- Patent Title: Strapping structure of memory circuit
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Application No.: US16704404Application Date: 2019-12-05
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Publication No.: US10685952B2Publication Date: 2020-06-16
- Inventor: Jhon Jhy Liaw
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L27/112

Abstract:
A memory circuit includes a first memory cell and a second memory adjacent to the first memory cell. The first memory cell includes a first word line strapping line segment electrically coupled with a pass device of the first memory cell; and a second word line strapping line segment. The second memory cell includes a first word line strapping line segment; and a second word line strapping line segment electrically coupled with a pass device of the second memory cell. The first word line strapping line segment of the first memory cell and the first word line strapping line segment of the second memory cell are connected with each other at a first interconnection layer. The second word line strapping line segment of the first memory cell and the second word line strapping line segment of the second memory cell are connected with each other at the first interconnection layer.
Public/Granted literature
- US20200111775A1 Strapping Structure of Memory Circuit Public/Granted day:2020-04-09
Information query
IPC分类: