Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US15987318Application Date: 2018-05-23
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Publication No.: US10686047B2Publication Date: 2020-06-16
- Inventor: Ta-Yuan Kung , Ruey-Hsin Liu , Chen-Liang Chu , Chih-Wen Yao , Ming-Ta Lei
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/78 ; H01L29/66 ; H01L21/762 ; H01L29/06

Abstract:
A semiconductor device includes a semiconductor substrate, a gate dielectric, a gate electrode and a pair of source/drain regions. The gate dielectric is disposed in the semiconductor substrate having a concave profile that defines an upper boundary lower than an upper surface of the semiconductor substrate. The gate electrode is disposed over the gate dielectric. The pair of source/drain regions are disposed on opposing sides of the gate dielectric.
Public/Granted literature
- US20190363165A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2019-11-28
Information query
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