Invention Grant
- Patent Title: Semiconductor device and manufacturing methods thereof
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Application No.: US15447679Application Date: 2017-03-02
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Publication No.: US10686072B2Publication Date: 2020-06-16
- Inventor: Yu-Hung Liao , Samuel C. Pan , Sheng-Ting Fan , Min-Hung Lee , Chee-Wee Liu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. , National Taiwan University
- Applicant Address: TW Hsinchu TW Taipei
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.,NATIONAL TAIWAN UNIVERSITY
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.,NATIONAL TAIWAN UNIVERSITY
- Current Assignee Address: TW Hsinchu TW Taipei
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L27/11585
- IPC: H01L27/11585 ; H01L29/78 ; H01L29/66 ; H01L27/1159 ; H01L29/51

Abstract:
A semiconductor device includes a source and a drain and a channel disposed between the source and the drain, a first gate dielectric layer disposed on the channel, a first gate electrode disposed on the first gate dielectric layer, a second gate dielectric layer disposed on the first gate electrode, and a second gate electrode disposed on the second gate dielectric layer. The second gate dielectric layer is made of a ferroelectric material. A first area of a bottom surface of the first gate electrode which is in contact with the first gate dielectric layer where the is greater than a second area of a bottom surface of the second gate dielectric layer which is in contact with the first gate electrode.
Public/Granted literature
- US20180166582A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHODS THEREOF Public/Granted day:2018-06-14
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