Invention Grant
- Patent Title: Semiconductor light emitting element and semiconductor light emitting element assembly
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Application No.: US15556970Application Date: 2015-12-17
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Publication No.: US10686291B2Publication Date: 2020-06-16
- Inventor: Hideki Watanabe , Katsunori Yanashima , Rintaro Koda , Moe Takeo , Nobukata Okano
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5d149cba
- International Application: PCT/JP2015/085329 WO 20151217
- International Announcement: WO2016/147512 WO 20160922
- Main IPC: H01S5/14
- IPC: H01S5/14 ; H01S5/022 ; H01S5/343 ; H01S5/0625 ; H01S5/06 ; H01S5/024 ; H01S5/026 ; H01S5/065 ; H01S5/10 ; H01S5/22 ; H01S5/50

Abstract:
A semiconductor light emitting element has a laminated structure formed by laminating a first compound semiconductor layer, an active layer, and a second compound semiconductor layer. The semiconductor light emitting element satisfies ΔI2>ΔI1, where ΔI1 is an operating current range when the temperature of the active layer is T1, and ΔI2 is the operating current range when the temperature of the active layer is T2 (where T2>T1). The semiconductor light emitting element satisfies P2>P1, where P1 is a maximum optical output emitted when the temperature of the active layer is T1, and P2 is the maximum optical output emitted when the temperature of the active layer is T2 (where T2>T1).
Public/Granted literature
- US20180054039A1 SEMICONDUCTOR LIGHT EMITTING ELEMENT AND SEMICONDUCTOR LIGHT EMITTING ELEMENT ASSEMBLY Public/Granted day:2018-02-22
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