Invention Grant
- Patent Title: MEMS microphone
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Application No.: US16509628Application Date: 2019-07-12
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Publication No.: US10687149B2Publication Date: 2020-06-16
- Inventor: Akifumi Kamijima , Tohru Inoue
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6015b57b
- Main IPC: H04R19/04
- IPC: H04R19/04 ; H04R3/04 ; H04R3/00 ; H04R25/00 ; B81B7/00

Abstract:
A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and an area of the second membrane is 1.21 times or more and 2.25 times or less an area of the first membrane when viewed in a thickness direction of the substrate.
Public/Granted literature
- US20200077201A1 MEMS MICROPHONE Public/Granted day:2020-03-05
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