Invention Grant
- Patent Title: Method and apparatus for decoupling uplink latency using common uplink burst in TDD subframe structure
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Application No.: US16163261Application Date: 2018-10-17
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Publication No.: US10687347B2Publication Date: 2020-06-16
- Inventor: Wei Zeng , Tingfang Ji , Joseph Binamira Soriaga , John Smee , Naga Bhushan
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Liem T. Do
- Main IPC: H04W72/12
- IPC: H04W72/12 ; H04L5/00 ; H04L5/14 ; H04L29/06 ; H04L1/00 ; H04L29/08 ; H04W52/36 ; H04W88/02 ; H04W88/08

Abstract:
Wireless communications systems and methods related to decoupling uplink latency using common uplink (UL) burst in Time Division Duplex (TDD) sub-frame structure are disclosed. User equipment (UE) can transmit to a base station a common UL burst in each sub-frame communicated between UE and the base station, wherein he common UL burst comprises at least one of: a physical layer (PHY) acknowledgement (ACK), a scheduling request (SR), a buffer status report (BSR), or a sounding reference signal (SRS). UE can be further configured to transmit scheduled UL payload data in at least one common UL burst of at least one sub-frame communicated between the UE and the base station.
Public/Granted literature
- US20190053262A1 METHOD AND APPARATUS FOR DECOUPLING UPLINK LATENCY USING COMMON UPLINK BURST IN TDD SUBFRAME STRUCTURE Public/Granted day:2019-02-14
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