An air-cooling heat dissipation device is provided for removing heat from an electronic component. The air-cooling heat dissipation device includes a base and an air pump. The base includes a passage, an introduction opening and a discharge opening. The electronic component is covered by the base. The electronic component is disposed within the passage. The air pump is fixed on the base and sealing the edge of the introduction opening. When the air pump is enabled, an ambient air is introduced into the passage through the introduction opening to remove the heat from the electronic component, and the air heated by the electronic component is exhausted through the discharge opening.