Invention Grant
- Patent Title: Fan module assembly
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Application No.: US15329574Application Date: 2014-08-29
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Publication No.: US10687442B2Publication Date: 2020-06-16
- Inventor: Joseph Anthony Oliver , Kelly K Smith , Keith A Sauer , James Jeffery Schulze
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- International Application: PCT/US2014/053369 WO 20140829
- International Announcement: WO2016/032510 WO 20160303
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F04D25/16 ; F04D29/40 ; F04D29/60 ; G06F1/20

Abstract:
Example implementations relate to a fan module assembly. One example fan module assembly includes a basepan housed in a chassis of a computing device. The basepan includes a distal end. The fan module assembly also includes a plurality of pins extending from the basepan. The plurality of pins includes a first pin and a second pin. The first pin and the second pin are staggered with respect to a plane defined by the distal end. The fan module assembly further includes a fan module attached to the basepan via the first pin and the second pin.
Public/Granted literature
- US20170265334A1 FAN MODULE ASSEMBLY Public/Granted day:2017-09-14
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