Invention Grant
- Patent Title: Methods of applying thermal interface materials to board level shields
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Application No.: US15783259Application Date: 2017-10-13
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Publication No.: US10687447B2Publication Date: 2020-06-16
- Inventor: Sri Talpallikar , Jason L. Strader
- Applicant: Laird Technologies, Inc.
- Applicant Address: US MO Chesterfield
- Assignee: Laird Technologies, Inc.
- Current Assignee: Laird Technologies, Inc.
- Current Assignee Address: US MO Chesterfield
- Agency: Harness, Dickey & Pierce, P.L.C.
- Agent Anthony G. Fussner
- Main IPC: B29C45/14
- IPC: B29C45/14 ; H05K9/00 ; H05K7/20 ; F28F13/00 ; F28F21/02 ; F28F21/08 ; H01L23/552 ; H05K1/02 ; H05K3/34
Abstract:
Disclosed are exemplary embodiments of board level shields including thermal interface materials. Also disclosed are methods of applying thermal interface materials to board level shields.
Public/Granted literature
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