Invention Grant
- Patent Title: Consolidating a build material for additive manufacturing
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Application No.: US15526948Application Date: 2015-02-27
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Publication No.: US10688716B2Publication Date: 2020-06-23
- Inventor: James Elmer Abbott, Jr.
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dierker & Kavanaugh PC
- International Application: PCT/US2015/018012 WO 20150227
- International Announcement: WO2016/010590 WO 20160121
- Main IPC: B29C64/165
- IPC: B29C64/165 ; B33Y10/00 ; B29C64/40 ; B29C64/386 ; B29C48/02 ; B29C48/92 ; B29C48/25 ; B33Y30/00 ; B33Y50/02 ; G05B19/4099 ; B29C64/393 ; B29C64/205
Abstract:
In one example, a non-transitory processor readable medium having instructions thereon that when executed cause an additive manufacturing machine to consolidate powdered build material into consolidated powdered build material and then form an object slice in the consolidated build material.
Public/Granted literature
- US20170326791A1 CONSOLIDATING A BUILD MATERIAL FOR ADDITIVE MANUFACTURING Public/Granted day:2017-11-16
Information query
