Invention Grant
- Patent Title: Thermal print head and thermal printer
-
Application No.: US16213138Application Date: 2018-12-07
-
Publication No.: US10688807B2Publication Date: 2020-06-23
- Inventor: Megumi Yamauchi , Seiichi Noro , Masakatsu Doi , Yoshihide Abe , Tomonori Suzuki , Yuuki Komori , Tsuyoshi Yamamoto
- Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
- Applicant Address: JP Asahikawa-Shi
- Assignee: Toshiba Hokuto Electronics Corporation
- Current Assignee: Toshiba Hokuto Electronics Corporation
- Current Assignee Address: JP Asahikawa-Shi
- Agency: Burr & Brown, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@18daea2c
- Main IPC: B41J2/355
- IPC: B41J2/355 ; B41J2/335

Abstract:
According to one embodiment, a thermal print head includes a heat sink, a head substrate having a plurality of heat generating elements placed on the heat sink and disposed in a primary scanning direction, a circuit board placed on the heat sink so as to be adjacent to the head substrate in an auxiliary scanning direction and provided with a connection circuit, and a control element electrically connected to the heat generating element via a first bonding wire and electrically connected to the connection circuit via a second bonding wire, wherein a plurality of first bonding wires is disposed in parallel in the primary scanning direction, and among the first bonding wires, the first bonding wire having a length of at least 2 mm or more is a metal wire having a Young's modulus greater than that of gold.
Public/Granted literature
- US20190193418A1 THERMAL PRINT HEAD AND THERMAL PRINTER Public/Granted day:2019-06-27
Information query
IPC分类: