Invention Grant
- Patent Title: Vertically stacked nanofluidic channel array
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Application No.: US15906806Application Date: 2018-02-27
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Publication No.: US10689245B2Publication Date: 2020-06-23
- Inventor: Juntao Li , Kangguo Cheng , Choonghyun Lee , Peng Xu
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: B81B1/00
- IPC: B81B1/00 ; B81C1/00 ; H01L21/3065 ; H01L21/02 ; H01L21/324 ; H01L29/16 ; H01L21/306 ; B01L3/00 ; G01N33/487

Abstract:
Techniques regarding a vertical nanofluidic channel array are provided. For example, one or more embodiments described herein can regard an apparatus that can comprise a semiconductor substrate and a dielectric layer adjacent to the semiconductor substrate. The dielectric layer can comprise a first nanofluidic channel and a second nanofluidic channel. The second nanofluidic channel can be located between the first nanofluidic channel and the semiconductor substrate.
Public/Granted literature
- US20190263655A1 VERTICALLY STACKED NANOFLUIDIC CHANNEL ARRAY Public/Granted day:2019-08-29
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