Invention Grant
- Patent Title: Semiconductor device package including a wall and a grounding ring exposed from the wall
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Application No.: US14855684Application Date: 2015-09-16
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Publication No.: US10689249B2Publication Date: 2020-06-23
- Inventor: Ching-Han Huang , Hsun-Wei Chan , Lu-Ming Lai
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaosiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaosiung
- Agency: Foley & Lardner LLP
- Main IPC: B81B7/00
- IPC: B81B7/00
Abstract:
A semiconductor device package includes a carrier, a wall disposed on a top surface of the carrier, a cover, and a sensor element. The cover includes a portion protruding from a bottom surface of the cover, where the protruding portion of the cover contacts a top surface of the wall to define a space. The sensor element is positioned in the space.
Public/Granted literature
- US20170073221A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-03-16
Information query
