Invention Grant
- Patent Title: Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same
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Application No.: US15496334Application Date: 2017-04-25
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Publication No.: US10689512B2Publication Date: 2020-06-23
- Inventor: Shur-Fen Liu , Meng-Huei Chen
- Applicant: TAIWAN UNION TECHNOLOGY CORPORATION
- Applicant Address: TW Chupei, Hsinchu
- Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
- Current Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
- Current Assignee Address: TW Chupei, Hsinchu
- Agency: Ferrells, PLLC
- Agent Michael Ferrell; Anna Kinney
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@229e3f2c
- Main IPC: C08L71/12
- IPC: C08L71/12 ; C08J5/24 ; C09D171/12 ; H05K1/03 ; H05K3/00
Abstract:
A resin composition is provided. The resin composition comprises the following: (a) a resin system, which comprises a thermosetting resin constituent and a vinyl-containing elastomer and has a dissipation factor (Df) of not higher than 0.008 at 10 GHz after curing; and (b) a phosphorous-containing flame retardant, which is a compound of formula (I), a compound of formula (II), or a combination thereof: wherein R1, R2, R21, R22, R23, R24, and n are as defined in the specification.
Public/Granted literature
- US20180208765A1 Resin Composition, and Prepreg, Metal-Clad Laminate, and Printed Circuit Board Using the Same Public/Granted day:2018-07-26
Information query
IPC分类:
