Invention Grant
- Patent Title: Thermally conductive adhesive
-
Application No.: US15695383Application Date: 2017-09-05
-
Publication No.: US10689551B2Publication Date: 2020-06-23
- Inventor: Ruediger Butterbach , Patrick Markiefka , Carsten Schubert , Judith Siepenkothen , Siegfried Kopannia
- Applicant: HENKEL AG & CO. KGAA
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL AG & CO. KGAA
- Current Assignee: HENKEL AG & CO. KGAA
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@421dd0f1
- Main IPC: C08J11/04
- IPC: C08J11/04 ; C09J11/04 ; C09K5/14
Abstract:
The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof and methods for the manufacture of articles with improved thermal conductivity using said adhesive compositions. The adhesive compositions of the invention comprise at least one (co)polymer binder and combination of different fillers, as defined herein.
Public/Granted literature
- US20170362473A1 THERMALLY CONDUCTIVE ADHESIVE Public/Granted day:2017-12-21
Information query
