Invention Grant
- Patent Title: Method for cleaning wire and device therefor
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Application No.: US15509878Application Date: 2014-09-10
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Publication No.: US10689765B2Publication Date: 2020-06-23
- Inventor: Toyofumi Watanabe
- Applicant: Nakagawa Special Steel Inc. , Toyofumi Watanabe
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Nakagawa Special Steel Inc.,Toyofumi Watanabe
- Current Assignee: Nakagawa Special Steel Inc.,Toyofumi Watanabe
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: The Webb Law Firm
- International Application: PCT/JP2014/073897 WO 20140910
- International Announcement: WO2016/038701 WO 20160317
- Main IPC: C23G1/02
- IPC: C23G1/02 ; C23G1/08 ; C23G3/02 ; B08B3/02 ; B08B3/04 ; B08B3/14

Abstract:
This method for cleaning wires enables effective descaling and removal of smuts from wires, prevents yellowing after cleaning, and significantly reduces the amount of water discharged as a result of cleaning, said method including, in the stated order: (A) pickling a wire; (B) cleaning the wire with acidic pressurized water, the concentration of which is adjusted with water and collected pickle solution which has adhered to and been recovered by the wire after use in Step (A); and (C) cleaning the wire with water.
Public/Granted literature
- US20170306508A1 Method for Cleaning Wire and Device Therefor Public/Granted day:2017-10-26
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