Invention Grant
- Patent Title: Three dimensional optical interconnects
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Application No.: US16298354Application Date: 2019-03-11
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Publication No.: US10690845B1Publication Date: 2020-06-23
- Inventor: Ajey Poovannummoottil Jacob , Abu Thomas , Yusheng Bian
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Roberts, Calderon, Safran & Cole, P.C.
- Agent Anthony Canale; Andrew M. Calderon
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/124 ; G02B6/136 ; H01L27/12 ; G02B6/30

Abstract:
The present disclosure relates to semiconductor structures and, more particularly, to three dimensional (3D) optical interconnect structures and methods of manufacture. The structure includes: a first structure having a grating coupler and a first optical waveguide structure; and a second structure having a second optical waveguide structure in alignment with the first optical waveguide structure and which has a modal effective index that matches to the first optical waveguide structure.
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