Invention Grant
- Patent Title: Method for manufacturing wiring board and wiring board
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Application No.: US16066021Application Date: 2016-12-22
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Publication No.: US10691270B2Publication Date: 2020-06-23
- Inventor: Shinsuke Aoshima , Kazutoshi Koshimizu
- Applicant: FUJIKURA LTD.
- Applicant Address: JP Tokyo
- Assignee: Fujikura Ltd.
- Current Assignee: Fujikura Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Osha Liang LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@533803bf
- International Application: PCT/JP2016/088411 WO 20161222
- International Announcement: WO2017/111039 WO 20170629
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/10 ; G06F3/044 ; H05K1/09 ; H05K1/02 ; H05K3/12
Abstract:
A method is provided for manufacturing a wiring board that includes a conductor part including a first line and a second line wider than the first line. The method includes: a first process of forming the first line and a boundary line corresponding to at least a portion of an outline of the second line near the first line; and a second process of forming a remaining portion of the second line.
Public/Granted literature
- US20190018521A1 METHOD FOR MANUFACTURING WIRING BOARD AND WIRING BOARD Public/Granted day:2019-01-17
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