Invention Grant
- Patent Title: Process for analyzing printed circuit board and packaging manufacturing design rules
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Application No.: US16126734Application Date: 2018-09-10
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Publication No.: US10691868B1Publication Date: 2020-06-23
- Inventor: Randall Scott Lawson , Utpal Bhattacharyya , Edward B. Acheson , Robert Roesler
- Applicant: Cadence Design Systems, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cadence Design Systems, Inc.
- Current Assignee: Cadence Design Systems, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Holland & Knight LLP
- Agent Mark H. Whittenberger, Esq.
- Main IPC: G06F30/398
- IPC: G06F30/398 ; G05B19/4097 ; G06F30/36 ; G06F113/18

Abstract:
The present disclosure relates to a system and method for use in an electronic circuit design. Embodiments may include an electronic computer aided design (“CAD”) system configured to receive one or more design rules and to receive one or more manufacturing rules. The CAD system may be further configured to analyze design database objects from the electronic design with respect to the manufacturing rules. The CAD system may generate a manufacturing output file, based upon, at least in part, the analyzing. Embodiments may also include a signoff computer aided manufacturing (“CAM”) station configured to receive the manufacturing output file. The CAM station may be configured to attempt to validate the manufacturing output file.
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