Invention Grant
- Patent Title: Wiring member
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Application No.: US16592910Application Date: 2019-10-04
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Publication No.: US10692628B2Publication Date: 2020-06-23
- Inventor: Hironobu Yamamoto , Kyungwoo Kim , Toshinari Kobayashi
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP Yokkaichi, Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Yokkaichi, Mie
- Agency: Honigman LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4ecfaf21
- Main IPC: H01B7/18
- IPC: H01B7/18 ; H01B3/30

Abstract:
An object of the present disclosure is to provide a technique with which it is possible to prevent the occurrence of a cable becoming uncovered. A wiring member includes wires, and a resin molded portion. The resin molded portion includes a first protective portion configured to cover an intermediate portion of the wires, and a second protective portion that is formed thinner than the first protective portion and is configured to be continuous with and cover a lending end side of the wires and relative to first protective portion. For example, the wiring member further includes an outer covering member that covers the second protective portion and the wires that extend from the second protective portion.
Public/Granted literature
- US20200111588A1 WIRING MEMBER Public/Granted day:2020-04-09
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