Invention Grant
- Patent Title: Multilayer ceramic electronic component
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Application No.: US16158162Application Date: 2018-10-11
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Publication No.: US10692654B2Publication Date: 2020-06-23
- Inventor: Kyoung Jin Cha , Hyung Soon Kwon , Ji Hong Jo
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1da7276f
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; H01G4/008

Abstract:
A multilayer ceramic electronic component includes a body including an internal electrode alternately arranged with a dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes a plurality of nickel (Ni) grains, and a composite layer including tin (Sn) and nickel (Ni) is disposed at a grain boundary of the nickel (Ni) grains.
Public/Granted literature
- US20200058444A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2020-02-20
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