Invention Grant
- Patent Title: Laser processing apparatus
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Application No.: US15586921Application Date: 2017-05-04
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Publication No.: US10692740B2Publication Date: 2020-06-23
- Inventor: Naotoshi Kirihara
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, Ltd.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@19bb9b96
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B23K26/0622 ; B23K26/351 ; B23K26/382 ; H01L21/687 ; H01L21/78 ; B23K26/359 ; B23K101/40

Abstract:
A laser oscillator of a laser processing apparatus generates burst pulses each composed of a plurality of sub-pulses. The plurality of sub-pulses are generated in such a manner that the energy of the sub-pulse sequentially changes from a lower energy to a higher energy, and the burst pulses are applied to a wafer, whereby the wafer is formed therein with shield tunnels extending from the front surface to the back surface of the wafer and each being composed of a minute hole and an amorphous phase surrounding the minute hole.
Public/Granted literature
- US20170330774A1 LASER PROCESSING APPARATUS Public/Granted day:2017-11-16
Information query
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