Invention Grant
- Patent Title: Integrated antenna on interposer substrate
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Application No.: US16210094Application Date: 2018-12-05
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Publication No.: US10692763B2Publication Date: 2020-06-23
- Inventor: Bo-Jr Huang , William Wu Shen , Chin-Her Chien , Chin-Chou Liu , Yun-Han Lee
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01Q1/48
- IPC: H01Q1/48 ; H01L21/768 ; H01L23/498 ; H01L21/48 ; H01L23/66 ; H01Q1/22 ; H01Q9/04 ; H01L23/48 ; H01L23/00

Abstract:
The present disclosure, in some embodiments, relates to an integrated antenna structure. The structure includes an excitable element and a first ground plane. The first ground plane is disposed between a first surface of a semiconductor substrate and the excitable element. A first line that is normal to the first surface of the semiconductor substrate extends through both the first ground plane and the excitable element. A second ground plane is separated from the first ground plane by the semiconductor substrate. The second ground plane is electrically coupled to the first ground plane.
Public/Granted literature
- US20190109046A1 INTEGRATED ANTENNA ON INTERPOSER SUBSTRATE Public/Granted day:2019-04-11
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