Invention Grant
- Patent Title: Non-planar I/O and logic semiconductor devices having different workfunction on common substrate
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Application No.: US16253760Application Date: 2019-01-22
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Publication No.: US10692771B2Publication Date: 2020-06-23
- Inventor: Roman W. Olac-Vaw , Walid M. Hafez , Chia-Hong Jan , Pei-Chi Liu
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L27/12 ; H01L21/84 ; H01L21/28 ; H01L23/528 ; H01L27/088 ; H01L29/49 ; H01L21/8238 ; H01L29/66

Abstract:
Non-planar I/O and logic semiconductor devices having different workfunctions on common substrates and methods of fabricating non-planar I/O and logic semiconductor devices having different workfunctions on common substrates are described. For example, a semiconductor structure includes a first semiconductor device disposed above a substrate. The first semiconductor device has a conductivity type and includes a gate electrode having a first workfunction. The semiconductor structure also includes a second semiconductor device disposed above the substrate. The second semiconductor device has the conductivity type and includes a gate electrode having a second, different, workfunction.
Public/Granted literature
- US20190157153A1 NON-PLANAR I/O AND LOGIC SEMICONDUCTOR DEVICES HAVING DIFFERENT WORKFUNCTION ON COMMON SUBSTRATE Public/Granted day:2019-05-23
Information query
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