Invention Grant
- Patent Title: Flexible semiconductor device with graphene tape
-
Application No.: US15365549Application Date: 2016-11-30
-
Publication No.: US10692802B2Publication Date: 2020-06-23
- Inventor: You Ge , Meng Kong Lye , Zhijie Wang
- Applicant: NXP USA, INC.
- Applicant Address: US TX Austin
- Assignee: NXP USA, INC.
- Current Assignee: NXP USA, INC.
- Current Assignee Address: US TX Austin
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2d34a9f
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/498 ; H01L21/56 ; H01L23/31 ; H01L23/367 ; H01L23/373 ; H01L23/00 ; H01L23/13 ; H01L23/36
Abstract:
A flexible semiconductor device includes a first tape having bonding pads and conductive traces formed. A semiconductor die having a bottom surface is attached to the first tape and electrically connected to the bond pads by way of electrical contacts. A second tape is attached to a top surface of the semiconductor die. The first and second tapes encapsulate the semiconductor die, the electrical contacts, and at least a part of the conductive traces.
Public/Granted literature
- US20170358525A1 FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE Public/Granted day:2017-12-14
Information query
IPC分类:
