A semiconductor arrangement includes a circuit board having a metallization layer with first and second conductor tracks. The first conductor track has a base section and first, second and third sections, the third section arranged between the first and second sections. The second conductor track has first and second sections. The first section of the second conductor track is arranged between the first and third sections of the first conductor track. The second section of the second conductor track is arranged between the second and third sections of the first conductor track. The third section of the first conductor track is arranged between the first and second sections of the second conductor track. First and second subsets of semiconductor chips are arranged on the first section of the second conductor track. Third and fourth subsets of semiconductor chips are arranged on the second section of the second conductor track.