Invention Grant
- Patent Title: Hybrid composite film, method of fabricating the same, and integrated circuit device including hybrid composite film
-
Application No.: US16197957Application Date: 2018-11-21
-
Publication No.: US10692820B2Publication Date: 2020-06-23
- Inventor: Seung-won Kim , Jun-won Han , Yeon-woo Kim , Hye-yun Park , Cheol-sang Yoon , Kangtaek Lee , Hyungjoon Jeon , Young-Geon Song
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do KR Seoul
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,Industry-Academic Cooperation Foundation, Yonsei University
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,Industry-Academic Cooperation Foundation, Yonsei University
- Current Assignee Address: KR Suwon-si, Gyeonggi-do KR Seoul
- Agency: Lee IP Law, P.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@6aeb8079 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@17af2f58
- Main IPC: C01G53/00
- IPC: C01G53/00 ; H01M4/505 ; H01M4/525 ; C01B39/48 ; H01M10/0525 ; H01L23/00 ; H01L21/02 ; H01L23/373 ; C09C1/04 ; C09C3/08 ; H01L23/498 ; C09C3/12 ; C09D179/00

Abstract:
A hybrid composite film, a method of fabricating the hybrid composite film, and an integrated circuit device including the hybrid composite film, the hybrid composite film including a polymer film; and a plurality of organic-inorganic composite particles dispersed in the polymer film, wherein each particle of the plurality of organic-inorganic composite particles includes an inorganic particle and an organic capping layer surrounding the inorganic particle, the organic capping layer having a hydroxyl group-terminated end.
Public/Granted literature
Information query
IPC分类: