Invention Grant
- Patent Title: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
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Application No.: US16191358Application Date: 2018-11-14
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Publication No.: US10692827B2Publication Date: 2020-06-23
- Inventor: Matt E. Schwab , David J. Corisis , J. Michael Brooks
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L23/498 ; H01L21/56

Abstract:
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a system comprises a semiconductor component including an interposer substrate, a microelectronic die over the interposer substrate, and a connection structure composed of a volume of solder material between the interposer substrate and the microelectronic die. The connection structure can include at least one of (a) a single, unitary structure covering approximately all of the back side of the microelectronic die, and (b) a structure electrically isolated from internal active features of the microelectronic die. In some embodiments, the connection structure can be positioned to provide generally consistent stress distribution within the system.
Public/Granted literature
- US20190081015A1 PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES Public/Granted day:2019-03-14
Information query
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