Invention Grant
- Patent Title: ESD protection device structure compatible with CMOS process
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Application No.: US15986245Application Date: 2018-05-22
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Publication No.: US10692855B2Publication Date: 2020-06-23
- Inventor: Po-Chuan Lin , Shr-Hau Shiue
- Applicant: eGalax_eMPIA Technology Inc.
- Applicant Address: TW Taipei
- Assignee: EGALAX_EMPIA TECHNOLOGY INC.
- Current Assignee: EGALAX_EMPIA TECHNOLOGY INC.
- Current Assignee Address: TW Taipei
- Agency: Muncy, Geissler, Olds & Lowe, PC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1b4bf4c3
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/78 ; H01L29/10 ; H01L23/528 ; H01L27/088 ; H01L23/58 ; H01L27/092 ; H02H9/04

Abstract:
An ESD protection device structure compatible with CMOS process is disclosed. In the ESD protection device structure, a power source I/O unit or a signal I/O unit of an I/O circuit is electrically connected to an electrostatic discharge clamp circuit including multiple low-voltage PMOS structure are formed in the P-type substrate and connected in series. Source and gate on low voltage N-type well of first low-voltage PMOS structure are electrically connected to a high-voltage power terminal pad through a first power line, or electrically connected to a signal transmission terminal pad through a signal transmission line, and drain of final low-voltage PMOS structure is electrically connected to a high voltage ground terminal pad through second power line. The ESD protection device structure using the serially-connected low-voltage PMOS structures only, can use the circuit layout area more efficiently and provide high ESD tolerance.
Public/Granted literature
- US20190206857A1 ESD PROTECTION DEVICE STRUCTURE COMPATIBLE WITH CMOS PROCESS Public/Granted day:2019-07-04
Information query
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