Invention Grant
- Patent Title: 3D conductive ink printing method and inductor formed thereof
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Application No.: US16142817Application Date: 2018-09-26
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Publication No.: US10692965B2Publication Date: 2020-06-23
- Inventor: Chong Zhang , Andrew J. Brown , Sheng Li , Sai Vadlamani , Ying Wang
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L27/08
- IPC: H01L27/08 ; H01L49/02 ; H01F27/28 ; C09D11/52 ; H01L23/522 ; G05F1/625

Abstract:
Methods of forming an inductor using dry processes are described. A cavity is laser drilled in an insulator. A first magnetic material layer is printed in the cavity. An Ag conductive ink is printed on the first magnetic material layer and a second magnetic material layer printed on the ink. The ink has a trace sandwiched between the first and second magnetic material layers that provides a majority of the inductance of the inductor. A protective insulating layer protects the second magnetic material layer from a wet chemistry solution when contacts are formed to the ink. The second magnetic material layer and ink are deposited in or on the cavity.
Public/Granted literature
- US20200098848A1 3D CONDUCTIVE INK PRINTING METHOD AND INDUCTOR FORMED THEREOF Public/Granted day:2020-03-26
Information query
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