Invention Grant
- Patent Title: Method for manufacturing tunnel junction layer
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Application No.: US16401361Application Date: 2019-05-02
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Publication No.: US10693036B2Publication Date: 2020-06-23
- Inventor: Akira Uzawa , Noriyoshi Seo , Atsushi Matsumura , Noriyuki Aihara
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K. K.
- Current Assignee: SHOWA DENKO K. K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4c68dbfc com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@52d956f8
- Main IPC: H01L33/06
- IPC: H01L33/06 ; H01L33/00 ; H01L33/30 ; H01L33/40 ; H01L33/04 ; H01L33/08

Abstract:
A method for manufacturing a tunnel junction layer using organic vapor phase deposition, the method including: a first process that supplies a first material gas containing a group III element, a second material gas containing a group V element, and a third material gas containing a dopant of a first conductivity type, onto a compound semiconductor layer on which the tunnel junction layer is to be laminated; a second process that stops supplying the first material gas, the second material gas and the third material gas, and supplies a fourth material gas containing a dopant of a second conductivity type opposite to the first conductivity type; and a third process that continues to supply the fourth material gas, and further supplies a fifth material gas containing a group III element and a sixth material gas containing a group V element.
Public/Granted literature
- US20190259908A1 LIGHT-EMITTING DIODE AND METHOD FOR MANUFACTURING TUNNEL JUNCTION LAYER Public/Granted day:2019-08-22
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